"Burn-in" is a process in which semiconductor components are subjected to temperature stress testing to detect failures caused by design, material, process and/or manufacturing defects at an early stage.

Temperatures of 125 °C to 250 °C (257 °F to 482 °F), applied during the burn-in process, will be maintained for several hours or even days.

• exclusion of human error during device placement in the BIB
• device pin1 orientation in BIB
  • - damage to device during insertion into BIB
  • - handling of up to 1 x 1 mm devices
• preventing faulty devices due to incorrect orientation during insertion
• fully automated open top sockets (OTS) loading
• reliable and easy-to-use device handling system
• modular machine configurations and options as per specific/individual customer requirements
• flexible BIB clamping (different sizes)
• easily moveable, even by one person
• ergonomic control panel arrangement
• user-friendly software
• cost-efficient and easy-to-use conversion kits for different devices
• conversion time (incl. BIB change) less than 3 minutes

• highly accurate and reliable 4+1-axis portal pick-and-place robot system (±0.05 mm accuracy)
• high MTBF values, low maintenance efforts
• free pin1 orientation
• 17.3" widescreen HMI with multi-touch capability
• integrated camera system for pick-and-place position teaching
• RS232/TCP/IP or optional GPIB tester interfaces
• remote control via Ethernet